Contrary to Rumors, SiS to Persist with PC Chipset Business

Taiwanese company Silicon Integrated Systems has dismissed rumors that it is going to shut down its PC chipset business. It is now going to concentrate its resources on developing southbridges. SiS will persist with its PC chipset business and satisfy whatever demand there is for its products until 2011. It is currently concentrating on providing notebook chipsets. SiS supplies notebook chipsets to around 20 notebook manufacturers. Cut-throat competition and the precarious state of the global economy have made life difficult for SiS.
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amd, intel, motherboard, hardware, chipset, sis, southbridge, northbridge
NewsRumor: Intel to Launch Montevina Refresh Platform for Notebooks Next April
Posted 10/27/08 at 09:26:32 AM by Pulkit Chandna
Intel is going to update its Montevina notebook PC platform in April, 2009 with the introduction of the Montevina Refresh platform, according to a DIGITIMES report, which cites unnamed sources within Intel. The launch of the platform will be accompanied by two new processors, the Core 2 Duo T9900 and P8800.
Intel also plans to unveil its GM47 chipset for high-end notebooks in first quarter of next year. Entry-level and small form factor (SFF) PC will also not be over looked, as Intel will launch the GL43 and GS40 chipsets in July or August.
A deluge of new processors for the Centrino 2 platform are soon going to be made available by the world’s leading chip maker. Also, the GM55 chipset for Intel’s upcoming 6th generation Centrino platform, Calpella, will become available in July or August next year.
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launch, hardware, chipset, notebooks, Release, montevina, calpella, intel centrino 2, montevina refresh
NewsEVGA To Release SLI Board For Core i7
Posted 10/22/08 at 05:29:10 PM by Gordon Mah Ung
If you thought EVGA was out of the motherboard game with Nvida sitting out the Core i7 chipset game, think again. EVGA just released the spec’s of an upcoming Nehalem motherboard with SLI support.EVGA’s X58 SLI FTW mobo won’t be based on an nForce chip, instead it will use an Intel x58 chipset. The board will feature a six-DIMM slot configuration and support for both 2-way and 3-way SLI. The board is one of several that Nvidia will “bless” with SLI support in drivers. The other option to obtain SLI support is for board makers to integrate nForce 200 chips into the PCB. Most of the early X58 designs are foregoing the chip for now though. Nvidia did announce recently that Asus, MSI, Gigabyte and DFI as well as EVGA would support SLI. The cost of the SLI certification for boards without the nForce 200 has been reported to be as high as $30. Recently, however, Expreview.com, reported that Nvidia was charging $5. Nvidia has not verified any of the pricing saying that the cost varied from contract to contract based on the volume and terms set up in each deal. The company did pooh pooh the earlier report of $30 though.

Click through for more details about this newly announced board!
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intel, evga, motherboard, nehalem, chipset, x58, core i7, nvidia. sli
NewsMarital Bliss: Nvidia Officially Announces SLI Support for Select X58 Motherboards
Posted 10/22/08 at 08:35:20 AM by Paul Lilly
It's been a long and arduous wait, but enthusiasts who have dreamed of pairing multiple Nvidia videocards in an SLI configuration on an Intel chipset-based motherboard will soon walk in a silicon field of dreams. No longer the topic of speculation, Nvidia has officially announced that it has licensed its SLI technology to several top-tier motherboard manufacturers - Asus, EVGA, MSI, Gigabyte, and DFI - for upcoming motherboards based on Intel's X58 chipset.
"Asus is bringing many motherboards into production with support for Nvidia SLI technology, and a motherboard worthy of mention is the new Asus Rampage II Extreme which is based on Intel's upcoming X58 chipset," said Joe Hsieh, GM at Asus Motherboard Business Unit.
SLI-licensed motherboards have entered the final production stage and will launch concurrently with Intel's Core i7 processors next month. According to the press release, certified boards will include both those using the Nvidia nForce 200 SLI processor, as well as motherboards designed to run SLI natively through a licensing and certification program. And for you Crysis junkies, look for support for 3-way SLI configurations as well.

Rumor: Intel 5-Series Chipset Details Leaked to the Web

Following Intel's P55 chipset, which is expected to launch sometime late this summer, Intel will release four more mainstream chipsets in the first quarter of 2010. These include the H57, P57, Q57, and H55.
DigiTimes says the higher end H57, P57, and Q57 chipsets will boast support for a revamped version of Intel's Turbo Memory technology currently codenamed Braidwood. This will help with boot times by moving frequently accessed data away from the hard drive and over to Flash memory. The memory chips will also sport a dedicated NVRAM controller for SSD-like read and write speeds, Fudzilla says.
All chipsets will support up to 14 USB 2.0 ports (save for the H55, which checks in with 12), up to 6 SATA ports, and up to 8 PCI-E x1 ports (H55 again being the exception with 6 PCI-E x1 ports).

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intel, motherboard, chipset, build a pc, rumor, p57, q57, h57, p55, h55
NewsAMD Updates Chipset Schedule for Next Year
Posted 12/04/08 at 09:38:43 AM by Paul Lilly
AMD looks poised to kick off 2009 with a bang. Earlier this week, rumors surfaced of an updated CPU roadmap for the chip maker, which showed the suits in Santa Clara gearing up to release six new Phenom II X4 processors, along with various Athlon-branded chips. According to DigiTimes, AMD also has a few new chipsets on tap for the new year.
On the lower end, AMD will release its 760G chipset, an entry-level IGP part based on the RS780 architecture. DirectX10 and Shader Model 4.0 will both be represented in the760G, but noticeably absent will be the company's Unified Video Decoder (UVD), Hybrid CrossFireX technology, and HDMI and DisplayPort connectors.
A bit higher on the performance scale will be AMD's 790FX and 790GX IGP chipsets, both of which will support AM3 and the SB750 southbridge. Later in the year, AMD will introduce its RS880 IGP chipset, followed by the RD890 in September.
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NewsGigabyte Gears Up for Core i7 with Two New X58 Motherboards
Posted 11/05/08 at 07:51:40 AM by Paul Lilly
With Intel's new Core i7 platform nearing release, expect a deluge of X58 motherboard announcements by various manufacturers. EVGA has already offered a glimpse of its upcoming X58 SLI FTW board, and now Gigabyte follows suit with two boards of its own -- GA-EX58-EXTREME and GA-EX58-UD5 -- based on the enthusiast X58 chipset.
Both boards will sport six DIMM slots for three-channel DDR3 memory and support for up to a whopping 24GB of RAM, but the hardware ménage à trois doesn't end there. Both boards will also come ready for three-way SLI action, or if you prefer ATI brand videocards, you can get your groove on with three-way CrossFireX support. Other traits the two boards have in common include ten SATA 3Gb/s ports, a PATA connector, RAID support, 8-channel onboard audio, three Firewire ports, and a dozen USB 2.0 ports.
The GA-EX58-EXTREME separates itself by adding Gigabyte's "Hybrid Silent-Pipe 2" cooling solution and is being aimed at watercooling enthusiasts. By combining liquid cooling, screen cooling, and an external heatsink, Gigabyte claims users can expect upwards of a 30 percent drop in thermals. The GA-EX58-UD5, on the other hand, sticks to a more traditional air cooling scheme, while also adding

Ubuntu Mobile Internet Device (MID) Edition Developer Release

Ubuntu Mobile Internet Device (MID) Edition v8.04 has achieved its first public release today. Canonical is calling this version a “developers release.” There are two installable images, and one runnable KVM image.
From Canonical’s blog post:
We are delighted to be able to welcome Ubuntu Mobile Internet Device (MID) Edition 8.04 to the world as a full developers’ release. It is based on the Ubuntu Desktop Edition, and it is now available for download. The Ubuntu MID Edition 8.04 has been built by the Ubuntu Mobile and Embedded community that is sponsored by Canonical and in co-operation with Intel Moblin.org community to take advantage of the Intel(R) Atom Processor, the chipset that is underpinning the Mobile Internet Device (MID) category. Ubuntu MID Edition will always be an Open Source distribution and is freely available.
Comment » Posted in Intel MID, Mobile Linux, ubuntu
A Look at Ubuntu Mobile March 27th, 2008 by Ryan

Ubuntu Mobile is an Ubuntu edition that targets an exciting new class of computers called Mobile Internet Devices. Tthe software is tailored for the Mobile Internet Devices (MIDs) expected to launch in spring based on Intel’s Silverthorne technology and is designed to recognize basic iPhone-like gestures such as swiping to scroll through menus and websites.
A scrolling visual front end based on Flash or Clutter replaces the traditional Ubuntu desktop and is designed to be used solely with fingers, including with an on-screen keyboard.
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Comment » Posted in Intel MID, Mobile Linux, ubuntu
Intel Shows Off Next-Gen Mobile Platforms September 20th, 2007 by Ryan

At the Intel Developers Forum, Anand Chandrasekher, senior vice president of ultra mobility at Intel, showed off the new Menlow and the follow-up Moorestown mobile platforms for pocket Internet devices. Could this be the next-gen competition for the iPhone? Or might the iPhone even incorporate the new technology?
Menlow and Moorestown go in a different, and much more Intel-centric, direction. They’re ultra-low-power x86 chips, using Intel’s own instruction set that developers will be familiar with from desktop machines. While these chips aren’t designed to run Windows Vista, Intel asserts that it’ll be easier for developers to port software from other x86 platforms to the new chips as opposed to recoding for ARM. ARM, meanwhile, touts what they say is even lower power usage than the new Intel chips.
Menlow and Moorestown Mobile Internet Devices (MID) will connect to WiMAX, Wi-Fi (802.11 g/n), and 3G networks for total Internet connectivity (at least where 3G and/or WiMAX is installed).

Intel D865PERL: Potential For Fine Tuning

Intel D865PERL: Potential For Fine Tuning
Intel 865PE Chipset Board Revision 01 BIOS RL86510A...

Click on image for larger version
In addition to a model with the 875P chipset, Intel also sent a board with the 865PE to the test. It must be said from the outset, however, that this board is by far the slowest in the whole test field. The weaknesses can be seen in the memory interface, which only allows conservative timings. This once again reflects the manufacturer's corporate policy, which does not want to resort to the aggressive sales tactics of the competition. Essentially, Intel can be compared to the German manufacturer Siemens, whose boards have been tested by THG in the past.
Compared to the Canterwood version, the D865PERL has an integrated high-quality sound chip from Soundmax, which is equipped with a noise suppression feature and 3D functions. 5.1 audio connections and an optical SP/DIF are also included. Fans of video editing can also use the FireWire connection.
Connections on the Intel board.
Intel's Active Monitor.
//

44 – Intel D865PERL: Potential For ...
1 – Motherboard Trends 2003: Consumers Are Spoilt For Choice
2 – Motherboard Trends 2003: Consumers Are Spoilt For Choice, Continued
3 – Overview Test Candidates: 24 Boards On The Test Bench
4 – Abit IC7-G: For Overclocking Fans, Continued
5 – Abit IC7-G: For Overclocking Fans, Continued
6 – Abit IS7: Bitter Price War With PAT
7 – Abit IS7: Bitter Price War With PAT, Continued
8 – Aopen AX4C Max 2: Mid-Range Product With A Few Minor Faults
9 – Aopen AX4C Max 2: Mid-Range Product With A Few Minor Faults, Continued
10 – Aopen AX4C Max 2: Mid-Range Product With A Few Minor Faults, Continued
11 – Aopen AX4C Max: Cooling Element With Possible Danger Of Burning
12 – Aopen AXSPE Max: Restrained Enthusiasm
13 – Asus P4C800 Deluxe: Sparse Selection Of Equipment At A High Price
14 – Asus P4C800 Deluxe: Sparse Selection Of Equipment At A High Price, Conti...
15 – Asus P4C800 Deluxe: Sparse Selection Of Equipment At A High Price, Conti...
16 – Asus P4C800-E Deluxe: Good Choice With CSA Support
17 – Asus P4P800 Deluxe: The Only One With Activated PAT
18 – Asus P4P800 Deluxe: The Only One With Activated PAT, Continued
19 – BIOStar P4TCA Pro: Good Basis With WLAN
20 – BIOStar P4TCA Pro: Good Basis With WLAN, Continued
21 – BIOStar P4TCA Pro: Good Basis With WLAN, Continued
22 – Chaintech 9CJS Zenith: The Features Giant
23 – Chaintech 9CJS Zenith: The Features Giant, Continued
24 – Chaintech 9CJS Zenith: The Features Giant, Continued
25 – DFI Pro 875 Lan Party: A Feast For The Eyes In The Dark
26 – DFI Pro 875 Lan Party: A Feast For The Eyes In The Dark, Continued
27 – Elitegroup PF1: Get The Price Down!
28 – Elitegroup PF1: Get The Price Down! Continued
29 – Epox PE-4PCA3+: Above Average
30 – Epox PE-4PCA3+: Above Average, Continued
31 – Epox PE-4PDA2+: Better Than Its Big Brother
32 – Epox PE-4PDA2+: Better Than Its Big Brother, Continued
33 – Gigabyte: Four Boards With 865 And 875 Chipset
34 – Gigabyte GA-8KNXP Ultra: Top Class At A Top Price
35 – Gigabyte GA-8KNXP Ultra: Top Class At A Top Price, Continued
36 – Gigabyte GA-8KNXP Ultra: Top Class At A Top Price, Continued
37 – Gigabyte GA-8KNXP: Credit Where Credit's Due
38 – Gigabyte GA-8KNXP: Credit Where Credit's Due, Continued
39 – Gigabyte GA-8PENXP: Is PAT Activated?
40 – Gigabyte GA-8PENXP: Is PAT Activated? Continued
41 – Gigabyte GA-8IG1000Pro: Low Cost At A Cutthroat Price
42 – Intel D875PBZ: Spartan, Slow, Expensive
43 – Intel D875PBZ: Spartan, Slow, Expensive, Continued
44 – Intel D865PERL: Potential For Fine Tuning
45 – Intel D865PERL: Potential For Fine Tuning, Continued
46 – MSI 875P Neo-FIS2R (MS-6758): At A High Level
47 – MSI 875P Neo-FIS2R (MS-6758): At A High Level, Continued
48 – MSI 865PE Neo 2-FIS2R (MS-6728): Fastest In The Comparative Test
49 – QDI P4I875PMA-6AFR: Innovation - ATX Becomes Micro-ATX!
50 – QDI P4I875PMA-6AFR: Innovation - ATX Becomes Micro-ATX! Continued
51 – Soltek SL-86SPE-L: Color Me Purple
52 – Soyo P4I875 Dragon 2: Mega Features With Weaknesses
53 – Soyo P4I875 Dragon 2: Mega Features With Weaknesses, Continued
54 – Equipment And Overview Of All Test Candidates
55 – Equipment And Overview Of All Test Candidates, Continued
56 – Equipment And Overview Of All Test Candidates, Continued
57 – Equipment And Overview Of All Test Candidates, Continued
58 – Equipment And Overview Of All Test Candidates, Continued
59 – Equipment And Overview Of All Test Candidates, Continued
60 – Test Setup And Details
61 – Benchmarks In Windows XP
62 – OpenGL Games: Quake 3 Arena
63 – DirectX 8 Games: Comanche 4 Demo
64 – DirectX 8 Engine: 3D Mark 2001 SE
65 – MP3 Audio Encoding: MP3 Maker Platinum 3.04
66 – Archiving: WinRAR 3.11
67 – CPU And Multimedia: SiSoft Sandra 2003 SP1
68 – Office Application: PC Mark 2002
69 – Application: SPEC Viewperf 7.1
70 – Conclusion: Purchase Decision Not Dependent On Chipset
71 – Conclusion: Purchase Decision Not Dependent On Chipset, Continued
72 – Awards: Gigabyte GA-8KNXP (Intel 875P) And MSI Neo 2 (Intel 865PE)
Previous page Intel D875PBZ: Spartan, Slow,...
Next page Intel D865PERL: Potential For Fine...
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Content also available in: Mobo Tsunami! 24 Boards with the 865/875P Chipset
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Intel Corporation

Intel's second-generation Classmate

Intel has unveiled a new version of its Classmate mini-laptop reference design. Now targeting consumers and schoolchildren both, and running Linux or Windows XP, the device has a 30GB hard drive, a revised touchpad and keyboard, webcam, and a nine-inch screen.(Click here for a larger view of the Classmate/2Go PC)
Spread the word:digg this story
The original Classmate debuted in March 2007 as part of Intel's "World Ahead" program aimed at schoolchildren in emerging markets. Available with a 1GB SSD (solid-state drive) packing Linux or a 2GB SSD packing Windows XP, the Classmate was widely viewed as Intel's response to the Linux- and AMD-based OLPC (One Laptop Per Child) device.
Intel's second-generation Classmate(Click image to enlarge)The second-generation Classmate will be sold directly to the public. While Intel created the reference design (right), OEMs in various regions will be responsible for manufacturing and sales. First to announce is Portland-based Computer Technology Link (CTL), which says it will sell the Classmate as the 2Go PC (seen above) for prices ranging from $300 to $500.The Classmate now includes new features intended to help it compete with other mini-laptops, such as Asus's hot-selling Eee PC. While Intel has retained the three-pound device's kid-friendly rounded corners, it switched from the original Classmate's round touchpad to a conventional-looking square design. The Classmate also now includes a right-shift key, which was previously missing.Technical upgrades include a nine-inch screen, offering the same 800 x 480 resolution as the previous seven-inch panel. The new Classmate also includes a VGA-resolution webcam and an available six-cell battery, according to the company.Notably, Intel has moved away from flash storage to a 1.8-inch (sub laptop-sized) hard drive. With a suitable operating system installation, the Classmate could still be configured as a solid-state device, since it includes a bootable SD slot.Announcing the Classmate at its Intel Developer Forum (IDF) in Shanghai, China, Intel said future iterations of the product will use its Centrino Atom chipset. However, today's second-generation device uses a 900MHz Celeron ULV processor and an Intel 915GMS chipset. A single DIMM socket comes with 512MB of RAM installed, but supports up to 1GB of 400/533MHz DDR2 RAM.The Classmate includes 802.11b/g wireless networking, capable of working in a mesh configuration that allows multiple devices to share a single Internet connection. It also has a port for a wired 10/100 Ethernet connection.Other interfaces, pictured below, include microphone in, headphone out, and dual USB ports. Finally, the Classmate also offers stereo speakers. Unlike "grownup" laptops, however, the device does not include a VGA output.

The second-generation Classmate's ports

Features and specifications listed by Intel and CTL for the Classmate/2Go PC include:
Processor -- 900MHz Intel Celeron ULV, with 915GMS chipset
Memory -- 512MB of RAM, expandable to 1GB of 400/533MHz DDR2 RAM
Storage -- 1.8-inch hard disk drive, listed as 30GB by Intel, but specified as a 40GB, 4200-rpm unit by CTL
Display -- 9-inch LCD with 800 x 480 resolution
Camera -- webcam with 640 x 480 resolution
Networking:
LAN -- 10/100 Ethernet port
WLAN -- 802.11b/g, compatible with mesh networking
Other I/O:
2 x USB 2.0
audio mic in, line out
stereo speakers
Expansion -- SD slot
Dimensions -- 8.7 x 7.3 x 1.5 inches
Weight -- less than three poundsThe 2Go PC has already reached the hands of reviewers at CNET.com and Laptop magazine. CNET's Dan Ackerman said the device "isn't built for speed," but added that "the Windows XP operating system, Office, basic Web browsers, and media players worked reasonably well." Laptop's Joanna Stern reached similar conclusions about its performance, but called the second-generation Classmate a "serious improvement," and noted the potential for up to five hours of battery life.AvailabilityAccording to CTL, the 2Go PC will be available in May from the company's own website, here, and from Amazon. It will be offered with either Linux or Windows XP.To read CNET's review of a second-generation Classmate, from an undisclosed supplier, see here. Laptop's review of the CTL version is available here.

Intel, UC Santa Barbara Develop World's First Hybrid Silicon Laser

SANTA CLARA, Calif., Sept. 18, 2006 – Researchers from Intel Corporation and the University of California, Santa Barbara (UCSB) have built the world’s first electrically powered Hybrid Silicon Laser using standard silicon manufacturing processes. This breakthrough addresses one of the last major barriers to producing low-cost, high-bandwidth silicon photonics devices for use inside and around future computers and data centers.
The researchers were able to combine the light-emitting properties of Indium Phosphide with the light-routing capabilities of silicon into a single hybrid chip. When voltage is applied, light generated in the Indium Phosphide enters the silicon waveguide to create a continuous laser beam that can be used to drive other silicon photonic devices. A laser based on silicon could drive wider use of photonics in computers because the cost can be greatly reduced by using high-volume silicon manufacturing techniques.
“This could bring low-cost, terabit-level optical ‘data pipes’ inside future computers and help make possible a new era of high-performance computing applications," said Mario Paniccia, director of Intel’s Photonics Technology Lab. "While still far from becoming a commercial product, we believe dozens, maybe even hundreds of hybrid silicon lasers could be integrated with other silicon photonic components onto a single silicon chip.”
"Our research program with Intel highlights how industry and academia can work together to advance the state of science and technology," said John Bowers, a professor of electrical and computer engineering at UC Santa Barbara. “By combining UCSB’s expertise with Indium Phosphide and Intel’s silicon photonics expertise, we have demonstrated a novel laser structure based on a bonding method that can be used at the wafer-, partial-wafer or die-level, and could be a solution for large-scale optical integration onto a silicon platform. This marks the beginning of highly integrated silicon photonic chips that can be mass produced at low cost.”
Technical Details
While widely used to mass produce affordable digital electronics today, silicon can also be used to route, detect, modulate and even amplify light, but not to effectively generate light. In contrast, Indium Phosphide-based lasers are commonly used today in telecommunications equipment. But the need to individually assemble and align them has made them too expensive to build in the high volumes and at the low costs needed by the PC industry.
The hybrid silicon laser involves a novel design employing Indium Phosphide-based material for light generation and amplification while using the silicon waveguide to contain and control the laser. The key to manufacturing the device is the use of a low-temperature, oxygen plasma -- an electrically charged oxygen gas -- to create a thin oxide layer (roughly 25 atoms thick) on the surfaces of both materials.
When heated and pressed together the oxide layer functions as a “glass-glue” fusing the two materials into a single chip. When voltage is applied, light generated in the Indium Phosphide-based material passes through the oxide “glass-glue” layer and into the silicon chip’s waveguide, where it is contained and controlled, creating a hybrid silicon laser. The design of the waveguide is critical to determining the performance and specific wavelength of the hybrid silicon laser. More information on the Hybrid Silicon Laser can be found at http://techresearch.intel.com/articles/tera-scale/1448.htm.
Today’s announcement builds on Intel’s other accomplishments in its long-term research program to “siliconize” photonics using standard silicon manufacturing processes. In 2004, Intel researchers were the first to demonstrate a silicon-based optical modulator with a bandwidth in excess of 1GHz, nearly 50 times faster than previous demonstrations of modulation in silicon. In 2005, Intel researchers were the first to demonstrate that silicon could be used to amplify light using an external light source to produce a continuous wave laser-on-a-chip based on the “Raman effect.”
Bowers has worked with Indium Phosphide-based materials and lasers for more than 25 years. Currently his research is focused on developing novel optoelectronic devices with data rates as high as 160Gb/s and techniques to bond dissimilar materials together to create new devices with improved performance.
Engineering at UC Santa Barbara
Engineering at UC Santa Barbara is considered a leader in bioengineering, chemical and computational engineering, materials science, nanotechnology, optics and physics. UCSB has five faculty Nobel Laureates. The College of Engineering’s uniquely successful interdisciplinary and entrepreneurial approach to research and learning is central to these achievements. http://www.engineering.ucsb.edu/.
About Intel
About IntelIntel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at http://www.intel.com/pressroom/index.htm and blogs.intel.com.
Intel, the Intel logo, Centrino, “Intel. Leap ahead.,”, “Intel. Leap ahead.” logo, Intel Viiv and Intel Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.