Tuesday, February 3, 2009

Contrary to Rumors, SiS to Persist with PC Chipset Business




Taiwanese company Silicon Integrated Systems has dismissed rumors that it is going to shut down its PC chipset business. It is now going to concentrate its resources on developing southbridges. SiS will persist with its PC chipset business and satisfy whatever demand there is for its products until 2011. It is currently concentrating on providing notebook chipsets. SiS supplies notebook chipsets to around 20 notebook manufacturers. Cut-throat competition and the precarious state of the global economy have made life difficult for SiS.
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amd, intel, motherboard, hardware, chipset, sis, southbridge, northbridge
NewsRumor: Intel to Launch Montevina Refresh Platform for Notebooks Next April
Posted 10/27/08 at 09:26:32 AM by Pulkit Chandna
Intel is going to update its Montevina notebook PC platform in April, 2009 with the introduction of the Montevina Refresh platform, according to a DIGITIMES report, which cites unnamed sources within Intel. The launch of the platform will be accompanied by two new processors, the Core 2 Duo T9900 and P8800.
Intel also plans to unveil its GM47 chipset for high-end notebooks in first quarter of next year. Entry-level and small form factor (SFF) PC will also not be over looked, as Intel will launch the GL43 and GS40 chipsets in July or August.
A deluge of new processors for the Centrino 2 platform are soon going to be made available by the world’s leading chip maker. Also, the GM55 chipset for Intel’s upcoming 6th generation Centrino platform, Calpella, will become available in July or August next year.
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launch, hardware, chipset, notebooks, Release, montevina, calpella, intel centrino 2, montevina refresh
NewsEVGA To Release SLI Board For Core i7
Posted 10/22/08 at 05:29:10 PM by Gordon Mah Ung
If you thought EVGA was out of the motherboard game with Nvida sitting out the Core i7 chipset game, think again. EVGA just released the spec’s of an upcoming Nehalem motherboard with SLI support.EVGA’s X58 SLI FTW mobo won’t be based on an nForce chip, instead it will use an Intel x58 chipset. The board will feature a six-DIMM slot configuration and support for both 2-way and 3-way SLI. The board is one of several that Nvidia will “bless” with SLI support in drivers. The other option to obtain SLI support is for board makers to integrate nForce 200 chips into the PCB. Most of the early X58 designs are foregoing the chip for now though. Nvidia did announce recently that Asus, MSI, Gigabyte and DFI as well as EVGA would support SLI. The cost of the SLI certification for boards without the nForce 200 has been reported to be as high as $30. Recently, however, Expreview.com, reported that Nvidia was charging $5. Nvidia has not verified any of the pricing saying that the cost varied from contract to contract based on the volume and terms set up in each deal. The company did pooh pooh the earlier report of $30 though.

Click through for more details about this newly announced board!
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intel, evga, motherboard, nehalem, chipset, x58, core i7, nvidia. sli
NewsMarital Bliss: Nvidia Officially Announces SLI Support for Select X58 Motherboards
Posted 10/22/08 at 08:35:20 AM by Paul Lilly
It's been a long and arduous wait, but enthusiasts who have dreamed of pairing multiple Nvidia videocards in an SLI configuration on an Intel chipset-based motherboard will soon walk in a silicon field of dreams. No longer the topic of speculation, Nvidia has officially announced that it has licensed its SLI technology to several top-tier motherboard manufacturers - Asus, EVGA, MSI, Gigabyte, and DFI - for upcoming motherboards based on Intel's X58 chipset.
"Asus is bringing many motherboards into production with support for Nvidia SLI technology, and a motherboard worthy of mention is the new Asus Rampage II Extreme which is based on Intel's upcoming X58 chipset," said Joe Hsieh, GM at Asus Motherboard Business Unit.
SLI-licensed motherboards have entered the final production stage and will launch concurrently with Intel's Core i7 processors next month. According to the press release, certified boards will include both those using the Nvidia nForce 200 SLI processor, as well as motherboards designed to run SLI natively through a licensing and certification program. And for you Crysis junkies, look for support for 3-way SLI configurations as well.

Rumor: Intel 5-Series Chipset Details Leaked to the Web


Following Intel's P55 chipset, which is expected to launch sometime late this summer, Intel will release four more mainstream chipsets in the first quarter of 2010. These include the H57, P57, Q57, and H55.
DigiTimes says the higher end H57, P57, and Q57 chipsets will boast support for a revamped version of Intel's Turbo Memory technology currently codenamed Braidwood. This will help with boot times by moving frequently accessed data away from the hard drive and over to Flash memory. The memory chips will also sport a dedicated NVRAM controller for SSD-like read and write speeds, Fudzilla says.
All chipsets will support up to 14 USB 2.0 ports (save for the H55, which checks in with 12), up to 6 SATA ports, and up to 8 PCI-E x1 ports (H55 again being the exception with 6 PCI-E x1 ports).

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intel, motherboard, chipset, build a pc, rumor, p57, q57, h57, p55, h55
NewsAMD Updates Chipset Schedule for Next Year
Posted 12/04/08 at 09:38:43 AM by Paul Lilly
AMD looks poised to kick off 2009 with a bang. Earlier this week, rumors surfaced of an updated CPU roadmap for the chip maker, which showed the suits in Santa Clara gearing up to release six new Phenom II X4 processors, along with various Athlon-branded chips. According to DigiTimes, AMD also has a few new chipsets on tap for the new year.
On the lower end, AMD will release its 760G chipset, an entry-level IGP part based on the RS780 architecture. DirectX10 and Shader Model 4.0 will both be represented in the760G, but noticeably absent will be the company's Unified Video Decoder (UVD), Hybrid CrossFireX technology, and HDMI and DisplayPort connectors.
A bit higher on the performance scale will be AMD's 790FX and 790GX IGP chipsets, both of which will support AM3 and the SB750 southbridge. Later in the year, AMD will introduce its RS880 IGP chipset, followed by the RD890 in September.
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NewsGigabyte Gears Up for Core i7 with Two New X58 Motherboards
Posted 11/05/08 at 07:51:40 AM by Paul Lilly
With Intel's new Core i7 platform nearing release, expect a deluge of X58 motherboard announcements by various manufacturers. EVGA has already offered a glimpse of its upcoming X58 SLI FTW board, and now Gigabyte follows suit with two boards of its own -- GA-EX58-EXTREME and GA-EX58-UD5 -- based on the enthusiast X58 chipset.
Both boards will sport six DIMM slots for three-channel DDR3 memory and support for up to a whopping 24GB of RAM, but the hardware ménage à trois doesn't end there. Both boards will also come ready for three-way SLI action, or if you prefer ATI brand videocards, you can get your groove on with three-way CrossFireX support. Other traits the two boards have in common include ten SATA 3Gb/s ports, a PATA connector, RAID support, 8-channel onboard audio, three Firewire ports, and a dozen USB 2.0 ports.
The GA-EX58-EXTREME separates itself by adding Gigabyte's "Hybrid Silent-Pipe 2" cooling solution and is being aimed at watercooling enthusiasts. By combining liquid cooling, screen cooling, and an external heatsink, Gigabyte claims users can expect upwards of a 30 percent drop in thermals. The GA-EX58-UD5, on the other hand, sticks to a more traditional air cooling scheme, while also adding

Ubuntu Mobile Internet Device (MID) Edition Developer Release


Ubuntu Mobile Internet Device (MID) Edition v8.04 has achieved its first public release today. Canonical is calling this version a “developers release.” There are two installable images, and one runnable KVM image.
From Canonical’s blog post:
We are delighted to be able to welcome Ubuntu Mobile Internet Device (MID) Edition 8.04 to the world as a full developers’ release. It is based on the Ubuntu Desktop Edition, and it is now available for download. The Ubuntu MID Edition 8.04 has been built by the Ubuntu Mobile and Embedded community that is sponsored by Canonical and in co-operation with Intel Moblin.org community to take advantage of the Intel(R) Atom Processor, the chipset that is underpinning the Mobile Internet Device (MID) category. Ubuntu MID Edition will always be an Open Source distribution and is freely available.
Comment » Posted in Intel MID, Mobile Linux, ubuntu
A Look at Ubuntu Mobile March 27th, 2008 by Ryan

Ubuntu Mobile is an Ubuntu edition that targets an exciting new class of computers called Mobile Internet Devices. Tthe software is tailored for the Mobile Internet Devices (MIDs) expected to launch in spring based on Intel’s Silverthorne technology and is designed to recognize basic iPhone-like gestures such as swiping to scroll through menus and websites.
A scrolling visual front end based on Flash or Clutter replaces the traditional Ubuntu desktop and is designed to be used solely with fingers, including with an on-screen keyboard.
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Comment » Posted in Intel MID, Mobile Linux, ubuntu
Intel Shows Off Next-Gen Mobile Platforms September 20th, 2007 by Ryan

At the Intel Developers Forum, Anand Chandrasekher, senior vice president of ultra mobility at Intel, showed off the new Menlow and the follow-up Moorestown mobile platforms for pocket Internet devices. Could this be the next-gen competition for the iPhone? Or might the iPhone even incorporate the new technology?
Menlow and Moorestown go in a different, and much more Intel-centric, direction. They’re ultra-low-power x86 chips, using Intel’s own instruction set that developers will be familiar with from desktop machines. While these chips aren’t designed to run Windows Vista, Intel asserts that it’ll be easier for developers to port software from other x86 platforms to the new chips as opposed to recoding for ARM. ARM, meanwhile, touts what they say is even lower power usage than the new Intel chips.
Menlow and Moorestown Mobile Internet Devices (MID) will connect to WiMAX, Wi-Fi (802.11 g/n), and 3G networks for total Internet connectivity (at least where 3G and/or WiMAX is installed).

Intel D865PERL: Potential For Fine Tuning



Intel D865PERL: Potential For Fine Tuning
Intel 865PE Chipset Board Revision 01 BIOS RL86510A...

Click on image for larger version
In addition to a model with the 875P chipset, Intel also sent a board with the 865PE to the test. It must be said from the outset, however, that this board is by far the slowest in the whole test field. The weaknesses can be seen in the memory interface, which only allows conservative timings. This once again reflects the manufacturer's corporate policy, which does not want to resort to the aggressive sales tactics of the competition. Essentially, Intel can be compared to the German manufacturer Siemens, whose boards have been tested by THG in the past.
Compared to the Canterwood version, the D865PERL has an integrated high-quality sound chip from Soundmax, which is equipped with a noise suppression feature and 3D functions. 5.1 audio connections and an optical SP/DIF are also included. Fans of video editing can also use the FireWire connection.
Connections on the Intel board.
Intel's Active Monitor.
//

44 – Intel D865PERL: Potential For ...
1 – Motherboard Trends 2003: Consumers Are Spoilt For Choice
2 – Motherboard Trends 2003: Consumers Are Spoilt For Choice, Continued
3 – Overview Test Candidates: 24 Boards On The Test Bench
4 – Abit IC7-G: For Overclocking Fans, Continued
5 – Abit IC7-G: For Overclocking Fans, Continued
6 – Abit IS7: Bitter Price War With PAT
7 – Abit IS7: Bitter Price War With PAT, Continued
8 – Aopen AX4C Max 2: Mid-Range Product With A Few Minor Faults
9 – Aopen AX4C Max 2: Mid-Range Product With A Few Minor Faults, Continued
10 – Aopen AX4C Max 2: Mid-Range Product With A Few Minor Faults, Continued
11 – Aopen AX4C Max: Cooling Element With Possible Danger Of Burning
12 – Aopen AXSPE Max: Restrained Enthusiasm
13 – Asus P4C800 Deluxe: Sparse Selection Of Equipment At A High Price
14 – Asus P4C800 Deluxe: Sparse Selection Of Equipment At A High Price, Conti...
15 – Asus P4C800 Deluxe: Sparse Selection Of Equipment At A High Price, Conti...
16 – Asus P4C800-E Deluxe: Good Choice With CSA Support
17 – Asus P4P800 Deluxe: The Only One With Activated PAT
18 – Asus P4P800 Deluxe: The Only One With Activated PAT, Continued
19 – BIOStar P4TCA Pro: Good Basis With WLAN
20 – BIOStar P4TCA Pro: Good Basis With WLAN, Continued
21 – BIOStar P4TCA Pro: Good Basis With WLAN, Continued
22 – Chaintech 9CJS Zenith: The Features Giant
23 – Chaintech 9CJS Zenith: The Features Giant, Continued
24 – Chaintech 9CJS Zenith: The Features Giant, Continued
25 – DFI Pro 875 Lan Party: A Feast For The Eyes In The Dark
26 – DFI Pro 875 Lan Party: A Feast For The Eyes In The Dark, Continued
27 – Elitegroup PF1: Get The Price Down!
28 – Elitegroup PF1: Get The Price Down! Continued
29 – Epox PE-4PCA3+: Above Average
30 – Epox PE-4PCA3+: Above Average, Continued
31 – Epox PE-4PDA2+: Better Than Its Big Brother
32 – Epox PE-4PDA2+: Better Than Its Big Brother, Continued
33 – Gigabyte: Four Boards With 865 And 875 Chipset
34 – Gigabyte GA-8KNXP Ultra: Top Class At A Top Price
35 – Gigabyte GA-8KNXP Ultra: Top Class At A Top Price, Continued
36 – Gigabyte GA-8KNXP Ultra: Top Class At A Top Price, Continued
37 – Gigabyte GA-8KNXP: Credit Where Credit's Due
38 – Gigabyte GA-8KNXP: Credit Where Credit's Due, Continued
39 – Gigabyte GA-8PENXP: Is PAT Activated?
40 – Gigabyte GA-8PENXP: Is PAT Activated? Continued
41 – Gigabyte GA-8IG1000Pro: Low Cost At A Cutthroat Price
42 – Intel D875PBZ: Spartan, Slow, Expensive
43 – Intel D875PBZ: Spartan, Slow, Expensive, Continued
44 – Intel D865PERL: Potential For Fine Tuning
45 – Intel D865PERL: Potential For Fine Tuning, Continued
46 – MSI 875P Neo-FIS2R (MS-6758): At A High Level
47 – MSI 875P Neo-FIS2R (MS-6758): At A High Level, Continued
48 – MSI 865PE Neo 2-FIS2R (MS-6728): Fastest In The Comparative Test
49 – QDI P4I875PMA-6AFR: Innovation - ATX Becomes Micro-ATX!
50 – QDI P4I875PMA-6AFR: Innovation - ATX Becomes Micro-ATX! Continued
51 – Soltek SL-86SPE-L: Color Me Purple
52 – Soyo P4I875 Dragon 2: Mega Features With Weaknesses
53 – Soyo P4I875 Dragon 2: Mega Features With Weaknesses, Continued
54 – Equipment And Overview Of All Test Candidates
55 – Equipment And Overview Of All Test Candidates, Continued
56 – Equipment And Overview Of All Test Candidates, Continued
57 – Equipment And Overview Of All Test Candidates, Continued
58 – Equipment And Overview Of All Test Candidates, Continued
59 – Equipment And Overview Of All Test Candidates, Continued
60 – Test Setup And Details
61 – Benchmarks In Windows XP
62 – OpenGL Games: Quake 3 Arena
63 – DirectX 8 Games: Comanche 4 Demo
64 – DirectX 8 Engine: 3D Mark 2001 SE
65 – MP3 Audio Encoding: MP3 Maker Platinum 3.04
66 – Archiving: WinRAR 3.11
67 – CPU And Multimedia: SiSoft Sandra 2003 SP1
68 – Office Application: PC Mark 2002
69 – Application: SPEC Viewperf 7.1
70 – Conclusion: Purchase Decision Not Dependent On Chipset
71 – Conclusion: Purchase Decision Not Dependent On Chipset, Continued
72 – Awards: Gigabyte GA-8KNXP (Intel 875P) And MSI Neo 2 (Intel 865PE)
Previous page Intel D875PBZ: Spartan, Slow,...
Next page Intel D865PERL: Potential For Fine...
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Content also available in: Mobo Tsunami! 24 Boards with the 865/875P Chipset
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Intel Corporation

Intel's second-generation Classmate


Intel has unveiled a new version of its Classmate mini-laptop reference design. Now targeting consumers and schoolchildren both, and running Linux or Windows XP, the device has a 30GB hard drive, a revised touchpad and keyboard, webcam, and a nine-inch screen.(Click here for a larger view of the Classmate/2Go PC)
Spread the word:digg this story
The original Classmate debuted in March 2007 as part of Intel's "World Ahead" program aimed at schoolchildren in emerging markets. Available with a 1GB SSD (solid-state drive) packing Linux or a 2GB SSD packing Windows XP, the Classmate was widely viewed as Intel's response to the Linux- and AMD-based OLPC (One Laptop Per Child) device.
Intel's second-generation Classmate(Click image to enlarge)The second-generation Classmate will be sold directly to the public. While Intel created the reference design (right), OEMs in various regions will be responsible for manufacturing and sales. First to announce is Portland-based Computer Technology Link (CTL), which says it will sell the Classmate as the 2Go PC (seen above) for prices ranging from $300 to $500.The Classmate now includes new features intended to help it compete with other mini-laptops, such as Asus's hot-selling Eee PC. While Intel has retained the three-pound device's kid-friendly rounded corners, it switched from the original Classmate's round touchpad to a conventional-looking square design. The Classmate also now includes a right-shift key, which was previously missing.Technical upgrades include a nine-inch screen, offering the same 800 x 480 resolution as the previous seven-inch panel. The new Classmate also includes a VGA-resolution webcam and an available six-cell battery, according to the company.Notably, Intel has moved away from flash storage to a 1.8-inch (sub laptop-sized) hard drive. With a suitable operating system installation, the Classmate could still be configured as a solid-state device, since it includes a bootable SD slot.Announcing the Classmate at its Intel Developer Forum (IDF) in Shanghai, China, Intel said future iterations of the product will use its Centrino Atom chipset. However, today's second-generation device uses a 900MHz Celeron ULV processor and an Intel 915GMS chipset. A single DIMM socket comes with 512MB of RAM installed, but supports up to 1GB of 400/533MHz DDR2 RAM.The Classmate includes 802.11b/g wireless networking, capable of working in a mesh configuration that allows multiple devices to share a single Internet connection. It also has a port for a wired 10/100 Ethernet connection.Other interfaces, pictured below, include microphone in, headphone out, and dual USB ports. Finally, the Classmate also offers stereo speakers. Unlike "grownup" laptops, however, the device does not include a VGA output.

The second-generation Classmate's ports


Features and specifications listed by Intel and CTL for the Classmate/2Go PC include:
Processor -- 900MHz Intel Celeron ULV, with 915GMS chipset
Memory -- 512MB of RAM, expandable to 1GB of 400/533MHz DDR2 RAM
Storage -- 1.8-inch hard disk drive, listed as 30GB by Intel, but specified as a 40GB, 4200-rpm unit by CTL
Display -- 9-inch LCD with 800 x 480 resolution
Camera -- webcam with 640 x 480 resolution
Networking:
LAN -- 10/100 Ethernet port
WLAN -- 802.11b/g, compatible with mesh networking
Other I/O:
2 x USB 2.0
audio mic in, line out
stereo speakers
Expansion -- SD slot
Dimensions -- 8.7 x 7.3 x 1.5 inches
Weight -- less than three poundsThe 2Go PC has already reached the hands of reviewers at CNET.com and Laptop magazine. CNET's Dan Ackerman said the device "isn't built for speed," but added that "the Windows XP operating system, Office, basic Web browsers, and media players worked reasonably well." Laptop's Joanna Stern reached similar conclusions about its performance, but called the second-generation Classmate a "serious improvement," and noted the potential for up to five hours of battery life.AvailabilityAccording to CTL, the 2Go PC will be available in May from the company's own website, here, and from Amazon. It will be offered with either Linux or Windows XP.To read CNET's review of a second-generation Classmate, from an undisclosed supplier, see here. Laptop's review of the CTL version is available here.

Intel, UC Santa Barbara Develop World's First Hybrid Silicon Laser


SANTA CLARA, Calif., Sept. 18, 2006 – Researchers from Intel Corporation and the University of California, Santa Barbara (UCSB) have built the world’s first electrically powered Hybrid Silicon Laser using standard silicon manufacturing processes. This breakthrough addresses one of the last major barriers to producing low-cost, high-bandwidth silicon photonics devices for use inside and around future computers and data centers.
The researchers were able to combine the light-emitting properties of Indium Phosphide with the light-routing capabilities of silicon into a single hybrid chip. When voltage is applied, light generated in the Indium Phosphide enters the silicon waveguide to create a continuous laser beam that can be used to drive other silicon photonic devices. A laser based on silicon could drive wider use of photonics in computers because the cost can be greatly reduced by using high-volume silicon manufacturing techniques.
“This could bring low-cost, terabit-level optical ‘data pipes’ inside future computers and help make possible a new era of high-performance computing applications," said Mario Paniccia, director of Intel’s Photonics Technology Lab. "While still far from becoming a commercial product, we believe dozens, maybe even hundreds of hybrid silicon lasers could be integrated with other silicon photonic components onto a single silicon chip.”
"Our research program with Intel highlights how industry and academia can work together to advance the state of science and technology," said John Bowers, a professor of electrical and computer engineering at UC Santa Barbara. “By combining UCSB’s expertise with Indium Phosphide and Intel’s silicon photonics expertise, we have demonstrated a novel laser structure based on a bonding method that can be used at the wafer-, partial-wafer or die-level, and could be a solution for large-scale optical integration onto a silicon platform. This marks the beginning of highly integrated silicon photonic chips that can be mass produced at low cost.”
Technical Details
While widely used to mass produce affordable digital electronics today, silicon can also be used to route, detect, modulate and even amplify light, but not to effectively generate light. In contrast, Indium Phosphide-based lasers are commonly used today in telecommunications equipment. But the need to individually assemble and align them has made them too expensive to build in the high volumes and at the low costs needed by the PC industry.
The hybrid silicon laser involves a novel design employing Indium Phosphide-based material for light generation and amplification while using the silicon waveguide to contain and control the laser. The key to manufacturing the device is the use of a low-temperature, oxygen plasma -- an electrically charged oxygen gas -- to create a thin oxide layer (roughly 25 atoms thick) on the surfaces of both materials.
When heated and pressed together the oxide layer functions as a “glass-glue” fusing the two materials into a single chip. When voltage is applied, light generated in the Indium Phosphide-based material passes through the oxide “glass-glue” layer and into the silicon chip’s waveguide, where it is contained and controlled, creating a hybrid silicon laser. The design of the waveguide is critical to determining the performance and specific wavelength of the hybrid silicon laser. More information on the Hybrid Silicon Laser can be found at http://techresearch.intel.com/articles/tera-scale/1448.htm.
Today’s announcement builds on Intel’s other accomplishments in its long-term research program to “siliconize” photonics using standard silicon manufacturing processes. In 2004, Intel researchers were the first to demonstrate a silicon-based optical modulator with a bandwidth in excess of 1GHz, nearly 50 times faster than previous demonstrations of modulation in silicon. In 2005, Intel researchers were the first to demonstrate that silicon could be used to amplify light using an external light source to produce a continuous wave laser-on-a-chip based on the “Raman effect.”
Bowers has worked with Indium Phosphide-based materials and lasers for more than 25 years. Currently his research is focused on developing novel optoelectronic devices with data rates as high as 160Gb/s and techniques to bond dissimilar materials together to create new devices with improved performance.
Engineering at UC Santa Barbara
Engineering at UC Santa Barbara is considered a leader in bioengineering, chemical and computational engineering, materials science, nanotechnology, optics and physics. UCSB has five faculty Nobel Laureates. The College of Engineering’s uniquely successful interdisciplinary and entrepreneurial approach to research and learning is central to these achievements. http://www.engineering.ucsb.edu/.
About Intel
About IntelIntel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at http://www.intel.com/pressroom/index.htm and blogs.intel.com.
Intel, the Intel logo, Centrino, “Intel. Leap ahead.,”, “Intel. Leap ahead.” logo, Intel Viiv and Intel Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.

Forget about 10 Watt processors; Intel's got plans for entire systems that fit in that thermal envelope


To quote Richard Feynman, "there's plenty of room at the bottom," and the microprocessor market is no exception. Although high performance is what captured Intel's attention for the past few years, the company is now aggressively targeting the low cost chip market, which holds immense potential and to this day remains largely uncultivated. Intel’s most recent roadmap reveals more information about the company’s newest ultra-low cost, ultra-low voltage platform, Diamondville. To set the record straight, Diamondville does not refer simply to low power CPUs, but in fact also refers to an entire platform. This is because Diamondville processors will come soldered directly onto specially designed boards. According Intel partner roadmaps leaked to DailyTech, its Diamondville line of processors are based on a completely new architecture drawn up on a “blank sheet of paper.” Intel plans to release two versions of its Diamondville processors, one for desktops and the other for mobile platforms.Intel’s first Diamondville chips are expected to be released towards the end of Q2’08. At this time, the company will launch the single-core Diamondville-SC 230, which is meant for desktop use, and the Diamondville-SC: 270, which is for use in mobile platforms. Both of these chips have very similar technical specifications, and will run at 1.60 GHz and feature 512KB cache. Intel guidance suggests that the first dual-core Diamondville chips will launch under the Celeron 3xx SKU. These new chips are expected to be targeted for desktop use only and will make an appearance in Q3’08. Diamondville processors have a mere 4W to 8W thermal envelope, and are heralded for fan-less design. Intel also boasts that a number of its “leading ODM” partners support Diamondville, so we can expect to see plenty of new products developed based on these chips. The success of products such as ASUS’ Eee PC has proven to companies that there is plenty of opportunity in the low cost market. Despite only offering modest technical specifications, the Eee PC has proven to be somewhat of a hit in the United States and not only in emerging markets as was expected prior to its release. Processors like Diamondville will help add growth to the low cost PC market not only abroad, but also in the United States. Already the major notebook designers have realized that the bottom of the chip market is just as important as the top.

Intel's role in CRANN


In order to meet the challenge of Moore's law, Intel has succeeded in reducing the feature size of its transistors to increase the speed of its devices. Intel started mass production of microprocessors with a feature size of less than 100nm in 2000, thus entering the era of nanotechnology. However, it is apparent that conventional feature size reduction, or scaling, can only take us so far with current materials and processes before we hit a wall at sub-10nm feature sizes. At this point, 'equivalent' scaling of devices through nanotechnology will emerge as the driving force behind Moore's Law. As part of its contribution to CRANN, Intel Ireland has provided five staff to the centre who are engaged in nanotechnology research. Peter Gleeson, Matt Shaw and Chris Murray work as Researchers-in-Residence based in TCD and UCC. Jenny Patterson is the Nanotechnology Program Manager. The products Intel Ireland manufacture in ten years will be based on fundamental research carried out today. Intel's involvement in CRANN is both recognition of the excellent research work underway in Irish universities and a commitment to add value to Intel Ireland through the groundbreaking application of nanotechnology.
Intel Ireland is the largest industrial partner in the CRANN project. Intel has been manufacturing various logic and memory products at its state of the art Irish fabs for over a decade. By successfully shrinking transistor size, we have been able to satisfy Moore's law which predicts computing density will double every two years. In order to continue to meet this aggressive roadmap, Intel recognizes the need for more advanced materials and processing capabilities in the coming years which go beyond 'conventional CMOS'. Nanotechnology in general offers many potential solutions to these future requirements. How can the incredible properties of novel materials such as nanotubes or nanowires be employed in our devices? Can we use templated self assembly to 'grow' nanoscale structures in place rather than use expensive lithographic techniques? Can the spin of the electron be used to switch a transistor more effectively than its charge at sub-10nm gate lengths? These important questions are being addressed by the three individual research projects being carried out by the Intel Researchers in Residence within CRANN. These Intel employees work within the university research groups, learning the theory and techniques necessary to make progress on the issues and providing an 'industrial' view on applications and requirements. One successful outcome of this relationship so far is the information exchange between the university groups and Intel's Materials Analysis labs. Another important outcome has been the realization of substrates from the 'Adaptive Grid' project. This project is truly multi-disciplinary in nature and aims to identify and overcome key challenges associated with the integration of top-down and bottom-up fabrication of processor type architectures, with a near-term focus in enabling the benchmarking of a range of nano-materials (e.g. materials formed by different process methods). To date expertise has been combined from the scientists in CRANN, with designers and fabrication engineers, integrators, and technicians in Intel Ireland to realise the first revision of a silicon substrate which will allow much more reliable testing of materials such as carbon nanotubes. This will provide a huge research advantage to CRANN for enhancements in place ability, contact ability, testability, and reproducibility of measurements.
Intel Ireland's participation in CRANN is both a commitment to nanotech solutions to future industry needs and recognition of the outstanding research work being carried out in Irish universities. Leonard Hobbs, overall Manager of Silicon Research at Intel Ireland says "Intel is delighted to have been involved in the CRANN team from the start. We recognise the unique advantage of collaborating with world class researchers in an area of strategic importance to our business and we look forward to continued success in collaborating with this international research institute."
The Intel Researchers-in-Residence

Jenny Patterson - Nanotechnology Program Manager
Jenny Patterson has been working at Intel for the past 6 years and holds the position of Nanotechnology Program Manager for Intel Ireland. Jenny is responsible for managing Intel Ireland's nanotechnology research initiatives in Ireland and Europe. Jenny manages Intel's interests in CRANN, a joint Industry-Academia Centre for Research on Adaptive Nanodevices and Nanostructures. Within CRANN, Intel staff perform fundamental scientific research on self-assembly, nanocontacting, and spintronics. In addition, Jenny oversees Intel Ireland's 6th and 7th EU framework activities in the area of nano-materials and nanoelectronics. Jenny transferred to her current role from Intel Ireland's Business Development Group in 2003; her role there was to identify and drive research opportunities for Intel in Ireland focusing on nanotechnology. Jenny originally joined Intel Ireland in 2001 as a Process Engineer for the 0.25 um and 0.18 um CVD manufacturing processes. Before joining Intel, Jenny worked in the National Microelectronics Research Centre (NMRC, now Tyndall National Institute) as Business Development Manager for the Microsystems Group. This work focused on commercialisation of existing MEMS based technology and devices, and further development of application driven uTAS (Total Analysis Systems) research. Jenny also previously worked for Bourns Inc., Microelectronics Division, as Engineering Project Leader working on new product development programs for electronic components, notably, environmental sensors, Thin Film on Silicon micro-inductors, and chip scale packaged passives. Prior to joining Bourns Inc., Jenny led the Plating Group, Interconnection & Packaging, at NMRC in commercially driven solar cell, passive component, and IC metallisation research and development. Jenny received a B.Sc. (Chemistry) and M.Sc. from University College, Cork.


Chris Murray - Researcher-in-Residence
Chris Murray joined CRANN in September 2004 as an Intel Researcher-in-Residence under the guidance of Prof. Mike Coey. He is working towards the demonstration of spintronic functionality in silicon-based devices. Previously he has been working with Intel Fab24 for over 3 years as Senior Process Engineer in the CVD module, 2 years of which were spent in Portland Technology Development, Oregon. Prior to that, he worked as a research assistant in the field of mesoporous silica low-k dielectrics at the Technical University of Chemnitz, Saxony, Germany. He also spent 4 years at the NMRC, Cork, Ireland researching magnetic materials and novel applications. In college he carried out short projects on magnetic thin films with Sony Applied Magnetic Research Labs, Tokyo and Thomson Central Research Labs, Paris. He has a B.A. in Science of Materials and M.Sc. in Physics (Hard Magnetic Materials), both from Trinity College Dublin. He has authored over 15 publications.



Matt Shaw - Researcher-in-Residence
Matt Shaw joined CRANN in August 2004 as an Intel Researcher-in-Residence under the guidance of Prof. Michael A. Morris in UCC. His current research interests include polymer templating and self-assembly processes to be used in the making of ordered arrays of nano-materials (wires, tubes etc.) with a view to integrating into functional novel transistor devices. He previously spent 11 years at Intel Ireland as a Senior Process Engineer working in the area of High Density Plasma CVD of low k dielectrics used in logic and flash technology processes. During his time at Intel he also spent 3 years working on CVD process development and transfer from Intel U.S R&D facilities to Intel Ireland. Matt was also a Defect Reduction Engineer for his first 3 years in Intel. His technical expertise includes many areas of CVD processing including vacuum systems, RF power systems, gas delivery and monitoring hardware, robotics, parts cleaning, transducers and sensors, and clean room technology. Matt has extensive knowledge of Semiconductor High Volume manufacturing equipment and people systems (Maintenance, Taskforces, Technology integration issues etc.).He has a B.Sc. in Applied Physics and Microelectronics (1991 DCU) and an M.Sc. in Physics (1993 DCU) in the spectroscopy of laser plasma XUV light sources. He has authored 12 publications. A very interesting aspect of Matt’s work is the Adaptive Grid Substrate project. This involves getting industry engineers from Intel and the PI’s and researchers from CRANN to work together to design and fabricate silicon test substrates for research use in CRANN. These substrates allow CRANN to be at forefront of nanoscience and enable Intel to facilitate the research community to carry out research potentially relevant to the ICT sector.


Peter Gleeson - Researcher-in-Residence
Peter has worked in the process engineering department of Intel Ireland since Nov 2003, and he joined the CRANN Institute as a researcher in residence in March 2006, where he is working on electrical contacting and characterization of nanowire based materials. Prior to joining Intel, he worked as a deposition / etch engineer for Hewlett-Packard and Agilent Technologies in their semiconductor fabrication facilities in the UK, where he was responsible for process development and technology transfer to manufacturing sites in the UK and Asia. Before he moved to industry, Peter spent seven years working on the development of high frequency compound semiconductor devices at the Tyndall National Institute. He has authored four publications, and holds a B.Sc. (Physics) from the University of Essex, UK.

INTEL
Intel Ireland is the largest industrial partner in the CRANN project. Intel has been manufacturing various logic and memory products at its state of the art Irish fabs for over a decade. By successfully shrinking transistor size, we have been able to satisfy Moore's law which predicts computing density will double every two years. In order to continue to meet this aggressive roadmap, Intel recognizes the need for more advanced materials and processing capabilities in the coming years which go beyond 'conventional CMOS'. Nanotechnology in general offers many potential solutions to these future requirements. How can the incredible properties of novel materials such as nanotubes or nanowires be employed in our devices? Can we use templated self assembly to 'grow' nanoscale structures in place rather than use expensive lithographic techniques? Can the spin of the electron be used to switch a transistor more effectively than its charge at sub-10nm gate lengths? These important questions are being addressed by the three individual research projects being carried out by the Intel Researchers in Residence within CRANN. These Intel employees work within the university research groups, learning the theory and techniques necessary to make progress on the issues and providing an 'industrial' view on applications and requirements. One successful outcome of this relationship so far is the information exchange between the university groups and Intel's Materials Analysis labs. Another important outcome has been the realization of substrates from the 'Adaptive Grid' project. This project is truly multi-disciplinary in nature and aims to identify and overcome key challenges associated with the integration of top-down and bottom-up fabrication of processor type architectures, with a near-term focus in enabling the benchmarking of a range of nano-materials (e.g. materials formed by different process methods). To date expertise has been combined from the scientists in CRANN, with designers and fabrication engineers, integrators, and technicians in Intel Ireland to realise the first revision of a silicon substrate which will allow much more reliable testing of materials such as carbon nanotubes. This will provide a huge research advantage to CRANN for enhancements in place ability, contact ability, testability, and reproducibility of measurements.
Intel Ireland's participation in CRANN is both a commitment to nanotech solutions to future industry needs and recognition of the outstanding research work being carried out in Irish universities. Leonard Hobbs, overall Manager of Silicon Research at Intel Ireland says "Intel is delighted to have been involved in the CRANN team from the start. We recognise the unique advantage of collaborating with world class researchers in an area of strategic importance to our business and we look forward to continued success in collaborating with this international research institute."

Company History: Intel Corporation


Incorporated: 1968 as N M ElectronicsNAIC: 334413 Semiconductor and Related Device Manufacturing; 334210 Telephone Apparatus Manufacturing
Intel Corporation is the largest semiconductor manufacturer in the world, with 11 fabrication facilities and six assembly and test facilities around the world. Intel has changed the global marketplace dramatically since it was founded in 1968; the company invented the microprocessor, the "computer on a chip" that made possible the first handheld calculators and personal computers (PCs). By the early 21st century, Intel's microprocessors were found in approximately 80 percent of PCs worldwide. The company's product line also includes chipsets and motherboards; flash memory used in wireless communications and other applications; networking devices and equipment for accessing the Internet, local area networks, and home networks; and embedded control microchips used in networking products, laser printers, factory automation instruments, cellular phone base stations, and other applications. Intel has remained competitive through a combination of clever marketing, well-supported research and development, superior manufacturing proficiency, a vital corporate culture, prowess in legal matters, and an ongoing alliance with software giant Microsoft Corporation often referred to as "Wintel."
Intel's founders, Robert Noyce and Gordon Moore, were among the eight founders of Fairchild Semiconductor Corporation, established in 1957. While at Fairchild, Noyce and Moore invented the integrated circuit; in 1968, they decided to form their own company. They were soon joined by Andrew Grove, a Hungarian refugee who had arrived in the United States in 1956 and joined Fairchild in 1963. Grove would remain president and CEO of Intel into the 1990s.
To obtain start-up capital, Noyce and Moore approached Arthur Rock, a venture capitalist, with a one-page business plan simply stating their intention of developing large-scale integrated circuits. Rock, who had helped start Fairchild Semiconductor, as well as Teledyne and Scientific Data Systems, had confidence in Noyce and Moore and provided $3 million in capital. The company was incorporated on July 18, 1968, as N M Electronics (the letters standing for Noyce Moore), but quickly changed its name to Intel, formed from the first syllables of "integrated electronics." Intel gathered another $2 million in capital before going public in 1971.
Noyce and Moore's scanty business proposal belied a clear plan to produce large-scale integrated (LSI) semiconductor memories. At that time, semiconductor memories were ten times more expensive than standard magnetic core memories. Costs were falling, however, and Intel's founders surmised that with the greater speed and efficiency of LSI technology, semiconductors would soon replace magnetic cores. Within a few months of its startup, Intel produced the 3101 Schottky bipolar memory, a high-speed random access memory (RAM) chip. The 3101 proved popular enough to sustain the company until the 1101, a metal oxide semiconductor (MOS) chip, was perfected and introduced in 1969. The following year, Intel introduced the 1103, a 1-kilobyte (K) dynamic RAM, or DRAM, which was the first chip large enough to store a significant amount of information. With the 1103, Intel finally had a chip that really did begin to replace magnetic cores; DRAMs eventually proved indispensable to the personal computer.
The company's most dramatic impact on the computer industry involved its 1971 introduction of the 4004, the world's first microprocessor. Like many of Intel's innovations, the microprocessor was a byproduct of efforts to develop another technology. When a Japanese calculator manufacturer, Busicom, asked Intel to design cost-effective chips for a series of calculators, Intel engineer Ted Hoff was assigned to the project; during his search for such a design, Hoff conceived a plan for a central processing unit (CPU) on one chip. The 4004, which crammed 2,300 transistors onto a one-eighth- by one-sixth-inch chip, had the power of the old 3,000-cubic-foot ENIAC computer, which depended on 38,000 vacuum tubes.
Although Intel initially focused on the microprocessor as a computer enhancement that would allow users to add more memory to their units, the microprocessor's great potential--for everything from calculators to cash registers and traffic lights--soon became clear. The applications were facilitated by Intel's introduction of the 8008, an 8-bit microprocessor developed along with the 4004 but oriented toward data and character (rather than arithmetic) manipulation. The 8080, introduced in 1974, was the first truly general purpose microprocessor. For $360, Intel sold a whole computer on one chip, while conventional computers sold for thousands of dollars. The response was overwhelming. The 8080 soon became the industry standard and Intel the industry leader in the 8-bit market.
In response to ensuing competition in the manufacture of 8-bit microprocessors, Intel introduced the 8085, a faster chip with more functions. The company was also developing two more advanced projects, the 32-bit 432 and the 16-bit 8086. The 8086 was introduced in 1978 but took two years to achieve wide use, and, during this time, Motorola, Inc. produced a competing chip (the 68000) that seemed to be selling faster. Intel responded with a massive sales effort to establish its architecture as the standard. When International Business Machines Corporation (IBM) chose the 8008, the 8086's 8-bit cousin, for its personal computer in 1980, Intel seemed to have beat out the competition.
During the 1970s, Intel had also developed the erasable programmable read-only memory (EPROM), another revolutionary but unintended research byproduct. Intel physicist Dov Frohman was working on the reliability problems of the silicon gate used in the MOS process when he realized that the disconnected, or "floating," gates that were causing malfunctions could be used to create a chip that was erasable and reprogrammable. Since conventional ROM chips had to be permanently programmed during manufacture, any change required the manufacture of a whole new chip. With EPROM, however, Intel could offer customers chips that could be erased and reprogrammed with ultraviolet light and electricity. At its introduction in 1971, EPROM was a novelty without much of a market. But the microprocessor, invented at the same time, created a demand for memory; the EPROM offered memory that could be conveniently used to test microprocessors.
Another major development at Intel during this time was that of peripheral controller chips. Streamlined for specific tasks and stripped of unneeded functions, peripheral chips could greatly increase a computer's abilities without raising software development costs. One of Intel's most important developments in peripherals was the coprocessor, first introduced in 1980. Coprocessor chips were an extension of the CPU that could handle specific computer-intensive tasks more efficiently than the CPU itself. Once again, innovation kept Intel ahead of its competition.
Intel's rapid growth, from the 12 employees at its founding in 1968 to 15,000 in 1980, demanded a careful approach to corporate culture. Noyce, Moore, and Grove, who remembered their frustration with Fairchild's bureaucratic bottlenecks, found that defining a workable management style was important. Informal weekly lunches with employees kept communication lines open while the company was small, but that system had become unwieldy. Thus, the founders installed a carefully outlined program emphasizing openness, decision-making on the lowest levels, discipline, and problem solving rather than paper shuffling. Moreover, the company's top executives eschewed such luxuries as limousines, expense account lunches, and private parking spaces to establish a sense of teamwork with their subordinates.
In an interview with the Harvard Business Review in 1980, Noyce remarked on the company's hiring policy, stating, "we expect people to work hard. We expect them to be here when they are committed to be here; we measure absolutely everything that we can in terms of performance." Employee incentives included options on Intel stock, and technological breakthroughs were celebrated with custom-bottled champagne--"Vintage Intel" marked the first $250 million quarter, in 1983--the year sales reached $1 billion for the first time.
During the 1974 recession, Intel was forced to lay off 30 percent of its employees, and morale declined substantially as a result. Thus, in 1981, when economic struggles again surfaced, instead of laying off more employees, Intel accelerated new product development with the "125 Percent Solution," which asked exempt employees to work two extra hours per day, without pay, for six months. A brief surge in sales the following year did not last, and, again, instead of more layoffs, Intel imposed pay cuts of up to 10 percent. Such measures were not popular among all its workforce, but, by June 1983, all cuts had been restored and retroactive raises had been made. Moreover, in December 1982, IBM paid $250 million for a 12 percent share of Intel, giving the company not only a strong capital boost, but also strong ties to the undisputed industry leader. IBM would eventually increase its stake to 20 percent before selling its Intel stock in 1987.
During the early 1980s, Intel began to slip in some of its markets. Fierce competition in DRAMs, static RAMs, and EPROMs left Intel concentrating on microprocessors. While competitors claimed that Intel simply gave away its DRAM market, Moore told Business Week in 1988 that the company deliberately focused on microprocessors as the least cyclical field in which to operate. Customer service, an area Intel had been able to overlook for years as it dominated its markets, became more important as highly efficient Japanese and other increasingly innovative competitors challenged Intel's position. In addition, Intel's manufacturing record, strained in years past by undercapacity, needed fixing. Fab 7, Intel's seventh wafer-fabrication plant, opened in 1983 only to face two years of troubled operations before reaching full capacity. Between 1984 and 1988, Intel closed eight old plants, and in 1988 it spent some $450 million on new technology to bring its manufacturing capacity into line with its developmental prowess.
Despite these retrenchments, the company continued to excel in the microprocessor market. In 1982 Intel introduced its 80286 microprocessor, the chip that quickly came to dominate the upper-end PC market, when IBM came out with the 286-powered PC/AT. The 286 was followed in 1985 by Intel's 80386 chip, popularized in 1987 by the Compaq DESKPRO 386, and which, despite bugs when it first came out, became one of the most popular chips on the market. While the 286 brought to the personal computer a speed and power that gave larger computers their first real challenge, the 386 offered even greater speed and power together with the ability to run more than one program at a time. The 386 featured 32-bit architecture and 275,000 transistors, more than twice the number of the 286.
In 1989 Intel introduced the 80486, a chip Business Week heralded as "a veritable mainframe-on-a-chip." The 486 included 1.2 million transistors and the first built-in math coprocessor, and was 50 times faster than the 4004, the first microprocessor. In designing the i486, Intel resisted an industry trend toward RISC (reduced instruction-set computing), a chip design that eliminated rarely used instructions in order to gain speed. Intel argued that what RISC chips gained in speed they lost in flexibility and that, moreover, RISC chips were not compatible with software already on the market, which Intel felt would secure the 486's position. A new chip, the 64-bit i860 announced in early 1989, however, did make use of RISC technology to offer what Intel claimed would be a "supercomputer on a chip."
Also in 1989, a major lawsuit that Intel had filed against NEC Corporation five years before was decided. Intel had claimed that NEC violated its copyright on the microcode, or embedded software instructions, of Intel's 8086 and 8088 chips. Although Intel had licensed NEC to produce the microcode, NEC had subsequently designed a similar chip of its own. At issue was whether microcode could be copyrighted. The court ruled that it could but that NEC had not violated any copyright in the case at hand. The suit made public some issues surrounding Intel's reputation. Some rivals and consumers, for example, claimed that Intel used its size and power to repress competition through such tactics as filing "meritless" lawsuits and tying microprocessor sales to other chips. Other observers, however, praised Intel's protection of its intellectual property and, subsequently, its profits. The Federal Trade Commission conducted a two-year investigation of Intel's practices and did not recommend criminal charges against the company, but two rival companies, Advanced Micro Devices, Inc. (AMD) and Cyrix Corporation, filed antitrust lawsuits against Intel in 1993.
Intel's annual net income topped $1 billion for the first time in 1992, following a very successful, brand-building marketing campaign. Intel ads aggressively sought to bolster consumer interest in and demand for computers that featured "Intel Inside." By late 1993, the company's brand equity totaled $17.8 billion, more than three times its 1992 sales. Also during this time, Intel began to branch out from chipmaking. In 1992 the company's Intel Products Group introduced network, communications, and personal conferencing products for retail sale directly to PC users.
In 1993 Intel released its fifth-generation Pentium processor, a trademarked chip capable of executing over 100 million instructions per second (MIPS) and supporting, for example, real-time video communication. The Pentium processor, with its 3.1 million transistors, was up to five times more powerful than the 33-megahertz Intel 486 DX microprocessor (and 1,500 times the speed of the 4004), but, in an unusual marketing maneuver, the company suggested that "all but the most demanding users" would seek out PCs powered by the previous chip. The Pentium's reputation was initially sullied by the revelation of an embedded mathematical flaw, but Intel moved quickly to fix the problem.
The company enjoyed a dramatic 50 percent revenue increase in 1993, reaching $8.78 billion from $5.84 billion in 1992. Moreover, Intel's net income leapt 115 percent to $2.3 billion, repudiating Wall Street's worries that competition had squeezed profit margins. While Intel faced strong competition both from chip makers such as Motorola's PowerPC and former partner IBM, its place at the leading edge of technology was undisputed.
A key initiative that kept Intel ahead of its competitors was the company's move beyond chip design into computer design. With the advent of the Pentium, Intel began designing chipsets and motherboards, the latter being the PC circuit board that combined a microprocessor and a chipset into the basic subsystem of a PC. With the company now selling the guts of a PC, dozens of computer manufacturers began making and selling Pentium-based machines.
In the mid-1990s, as sales of PCs accelerated and multimedia and the Internet were beginning to emerge, Intel continued developing ever more powerful microprocessors. In 1995 the Pentium Pro hit the market sporting 5.5 million transistors and capable of performing up to 300 MIPS. Intel next added MMX technology to its existing line of Pentium processors. MMX consisted of a new set of instructions that was designed specifically to improve the multimedia performance of personal computers. Fueled by exploding demand, revenues hit $20.85 billion by 1996, while net income soared to $5.16 billion.
At this point Intel was continuing its longtime strategy of designing new, more powerful chips for the top end of the market while allowing previous-generation microprocessors to migrate down to the lower segments of the market. With the introduction of the Pentium II in May 1997, however, the company adopted a new strategy of developing a range of microprocessors for every segment of the computing market. The Pentium II, with 7.5 transistors, debuted with a top-end model that clocked at 300 megahertz. Originally designed for high-end desktop PCs, the Pentium II was soon adapted for use in notebook and laptop computers. With the following year came the launch of the Celeron processor, which was designed specifically for the value PC desktop sector, a rapidly growing segment of the market ever since the early 1997 debut of a sub-$1,000 PC from Compaq. Also in 1998 Intel for the first time designed a microprocessor, the Pentium II Xeon, especially for midrange and higher-end servers and workstations. At the same time Intel was moving into another burgeoning sector, that of embedded control chips for networking and other applications, such as digital set-top boxes.
Meanwhile Intel settled a dispute with Digital Equipment Corporation (DEC) over the development of the Pentium chip by acquiring DEC's semiconductor operations. In May 1997 Craig R. Barrett was named president of Intel, having joined the company in 1974, serving as head of manufacturing starting in 1985, and being named chief operating officer in 1993. Grove remained chairman and CEO for one year, whereupon Barrett was named president and CEO, with Grove retaining the chairmanship. In early 1999 Intel reached a settlement with the Federal Trade Commission on an antitrust suit, thereby avoiding the protracted litigation and negative publicity that beset its Wintel partner, Microsoft, in the late 1990s. Reflecting the increasing importance of technology to the U.S. economy, Intel was added to the Dow Jones Industrial Average in November 1999.
During the late 1990s Intel made several strategic acquisitions that rapidly gave the company a significant presence in areas outside its microprocessor core: wireless communications products, such as flash memory for mobile phones and two-way pagers; networking building blocks, such as hubs, switches, and routers; and embedded control chips for laser printers, storage media, and automotive systems. Intel also entered the market for e-commerce services, rapidly building up the largest business-to-business e-commerce site in the world, with $1 billion per month in online sales by mid-1999. The company was not neglecting its core, however; in 1999 Intel had its largest microprocessor launch ever with the simultaneous introduction of 15 Pentium III and Pentium III Xeon processors.
The new product launches continued in 2000, but they were accompanied by an uncharacteristic series of blunders. In February arch-rival AMD had bested Intel by releasing the first 1-gigahertz chip, the Athlon, which had the added benefit of being cheaper than the Pentium III. Intel responded by speeding a 1.13-gigahertz version of the Pentium III to market, but the processor simply did not work right and thousands had to be recalled. Further embarrassment came when the firm had to recall a million motherboards because of a faulty chip. Intel had also underestimated growth in PC sales, leaving its production capacity insufficient to meet the demands of computer makers, and it also cancelled plans to develop a low-end microprocessor called Timna that had been slated for budget PCs. Intel continued to encounter problems developing the complex Itanium 64-bit processor, the company's first, which was specifically designed, in partnership with Hewlett-Packard Company, to meet the needs of powerful Internet servers. The long-delayed Itanium, seven years in the making at a cost of $2 billion, finally reached the market in 2001, receiving a rather muted initial reception. (The Itanium line was later shifted from servers to high-end computers.) On the bright side, Intel successfully released the Pentium 4 in November 2000. This processor included 42 million transistors and ran at an initial speed of 1.5 gigahertz, enabling Intel to regain the lead in the ongoing chip-speed battle with AMD. Despite all of the year's travails, Intel reached new heights in financial performance, earning $10.54 billion in profits on revenues of $33.73 billion.
The bursting of the Internet bubble posed new challenges for Intel in 2001 as consumer spending on computers dropped off and corporate information technology managers pulled back as well. The fierce competition from AMD prompted Intel to initiate a brutal price war, which cut both revenues and profits, and it also slashed Intel's worldwide share of the microprocessor market to below 80 percent, compared to the 86.7 percent figure from 1998. In 2001 Barrett began jettisoning many of the new ventures and acquisitions that were part of the late 1990s diversification drive, in a renewed refocusing on microprocessors. Revenues for 2001 fell 21 percent to $26.54 billion--the first such drop since the mid-1980s tech recession--while profits plummeted 87 percent to $1.29 billion. Early the following year, Paul Otellini was named president and chief operating officer, with Barrett remaining CEO. Otellini had served in a variety of marketing and management positions since joining the company in 1974, most recently serving as head of Intel's core operating unit, the architecture group, which was responsible for developing microprocessors, chipsets, and motherboards for desktop and notebook computers and for servers.
As the technology downturn continued in 2002, Intel cut thousands of workers from its payroll to reduce costs. Behind the scenes, an important change occurred in the company's approach to designing chips. Since the 1980s Intel had maintained its leading position by creating ever-faster processors. But by the early 2000s speed was becoming less important to the majority of PC users, who were mainly employing their desktop PCs and laptops to surf the Internet and run basic programs, such as word processors. Intel decided to deemphasize speed in favor of designing chips to better fit the way people were actually using their computers and to do so using technology "platforms," which were composed of several chips rather than a single microprocessor. The first fruit of this endeavor was Centrino, launched in early 2003. Centrino was a combination of chips specifically designed for portable computers. It included the Pentium M microprocessor, which while not sporting top speeds consumed much less power than the typical chip, providing for longer battery life (and reduced energy consumption when installed in desktop computers). The Pentium M was also smaller in size, making it less expensive to manufacture. Centrino also included a supporting chipset to further improve battery life and graphics performance as well as a wireless radio chip for connecting to the burgeoning number of wireless (Wi-Fi) networks being installed at corporate offices, in retail outlets, and within homes.
Buoyed by the success of Centrino, Intel's revenues hit a new high in 2004, $34.21 billion, despite a number of manufacturing glitches, product delays, and schedule changes during the year. Intel abandoned its efforts to develop television display chips and also scrapped plans to introduce the first 4-gigahertz processor because of problems with overheating. The profits of $7.52 billion were an impressive 33 percent higher than the previous year but below the peak reached in 2000.
In May 2005 Otellini became only the fifth CEO in Intel history and the first non-engineer. At the same time, Barrett succeeded Grove as chairman. One of the key legacies of Barrett's tenure was surely the huge outlay of capital, as much as $32 billion over six years, expended to rebuild Intel's manufacturing base and enabling the firm to increase capacity to meet chip demand and add capabilities to the products. At the same time, Otellini was credited with leading the push toward platforms, and this approach was institutionalized in a 2005 reorganization that divided the company into five market-focused groups: corporate computing, the digital home, mobile computing, healthcare, and channels (PCs for small manufacturers). Otellini was also shifting the product development effort toward so-called dual-core technology featuring two computing engines on a single piece of silicon. In this realm, Intel was competing fiercely with, and playing catchup to, AMD, which released its first dual-core chips for PCs in 2005, whereas Intel was aiming to produce three lines of dual-core processors, for notebooks, desktops, and servers, during the second half of 2006. Like the Centrino technology, dual-core chips were being developed to extend battery life in laptops and cut power costs for desktop PCs and servers. They were also intended to improve performance while avoiding the problems with overheating that had plagued some of the fastest single-processor models. Intel was simultaneously beginning work on multicore platforms with three or more "brains." Two other developments from mid-2005 held potential long-term significance. AMD filed a wide-ranging antitrust suit in U.S. federal court accusing Intel of using illegal inducements and coercion to discourage computer makers from buying AMD's computer chips. This action followed an antitrust ruling against Intel in Japan, earlier in the year. In the meantime, in what seemed a significant coup, Intel reached an agreement with Apple Computer, Inc. whereby Apple would begin shifting its Macintosh computers from IBM's PowerPC chips to Intel chips.
Principal Subsidiaries
Components Intel de Costa Rica, S.A.; Intel Americas, Inc.; Intel Asia Finance Ltd. (Cayman Islands); Intel Capital Corporation (Cayman Islands); Intel Copenhagen ApS (Denmark); Intel Corporation (UK) Ltd.; Intel Electronics Finance Limited (Cayman Islands); Intel Electronics Ltd. (Israel); Intel Europe, Inc.; Intel International; Intel International B.V. (Netherlands); Intel Ireland Limited (Cayman Islands); Intel Israel (74) Limited; Intel Kabushiki Kaisha (Japan); Intel Malaysia Sdn. Berhad; Intel Massachusetts, Inc.; Intel Overseas G.C. Ltd. (Cayman Islands); Intel Overseas Funding Corporation (Cayman Islands); Intel Phils. Holding Corporation; Intel Products (M) Sdn. Bhd. (Malaysia); Intel Puerto Rico, Ltd. (Cayman Islands); Intel Semiconductor Limited; Intel Technology Finance Limited; Intel Technology Phils., Inc. (Philippines); Intel Technology Sdn. Berhad (Malaysia); Mission College Investments Ltd. (Cayman Islands).
Principal Operating Units
Mobility Group; Digital Enterprise Group; Digital Home Group; Digital Health Group; Channel Platforms Group.
Principal Competitors
Advanced Micro Devices, Inc.; Samsung Electronics Co., Ltd.; Texas Instruments Incorporated; International Business Machines Corporation; STMicroelectronics N.V.
Further Reading
Brandt, Richard, Otis Port, and Robert D. Hof, "Intel: The Next Revolution," Business Week, September 26, 1988, p. 74.
Bylinsky, Gene, "Intel's Biggest Shrinking Job Yet," Fortune, May 3, 1982, pp. 250+.
Clark, Don, "AMD Files Broad Suit Against Intel," Wall Street Journal, June 28, 2005, p. A3.
------, "Change of Pace: Big Bet Behind Intel Comeback; In Chips, Speed Isn't Everything," Wall Street Journal, November 18, 2003, p. A1.
------, "Intel's New CEO Signals Shift for Chip Maker," Wall Street Journal, November 12, 2004, p. A6.
Clark, Don, and Gary McWilliams, "Intel Bets Big on Wireless Chips," Wall Street Journal, January 9, 2003, p. A3.
Clark, Don, Nick Wingfield, and William M. Bulkeley, "Apple Is Poised to Shift to Intel As Chip Supplier," Wall Street Journal, June 6, 2005, p. A1.
Clark, Tim, "Inside Intel's Marketing Machine," Business Marketing, October 1992, pp. 14-19.
Corcoran, Elizabeth, "Reinventing Intel," Forbes, May 3, 1999, pp. 154-59.
Intel: 35 Years of Innovation, Santa Clara: Intel Corporation, 2003.
Edwards, Cliff, "Getting Intel Back on the Inside Track," Business Week, November 29, 2004, p. 39.
------, "Intel: What Is CEO Craig Barrett Up To?," Business Week, March 8, 2004, pp. 56-62, 64.
------, "Shaking Up Intel's Insides," Business Week, January 31, 2005, p. 35.
Edwards, Cliff, and Ira Sager, "Intel: Can CEO Craig Barrett Reverse the Slide?," Business Week, October 15, 2001, pp. 80-86, 88, 90.
Edwards, Cliff, and Olga Karif, "This Is Not the Intel We All Know," Business Week, August 16, 2004, p. 32.
Garland, Susan B., and Andy Reinhardt, "Making Antitrust Fit High Tech," Business Week, March 22, 1999, p. 34.
Gottlieb, Carrie, "Intel's Plan for Staying on Top," Fortune, March 27, 1989, pp. 98+.
Grove, Andrew S., Swimming Across: A Memoir, New York: Warner, 2001, 290 p.
Heller, Robert, Andrew Grove, New York: Dorling Kindersley, 2001, 112 p.
Hof, Robert D., Larry Armstrong, and Gary McWilliams, "Intel Unbound," Business Week, October 9, 1995, pp. 148+.
"Is the Semiconductor Boom Too Much of a Good Thing for Intel?," Business Week, April 23, 1984, pp. 114+.
Jackson, Tim, Inside Intel: Andy Grove and the Rise of the World's Most Powerful Chip Company, New York: Dutton, 1997, 424 p.
Kirkpatrick, David, "Intel Goes for Broke," Fortune, May 16, 1994, pp. 62-66, 68.
------, "Intel's Amazing Profit Machine," Fortune, February 17, 1997, pp. 60+.
------, "Mr. Grove Goes to China," Fortune, August 17, 1998, pp. 154-61.
Lashinsky, Adam, "Is This the Right Man for Intel?," Fortune, April 18, 2005, pp. 110-12+.
Palmer, Jay, "Zero Hour," Barron's, October 4, 1999, pp. 33-34, 36.
Reinhardt, Andy, "Intel Inside Out: After a Year of Bloopers, Can the Chipmaker Get Its House in Order?," Business Week, December 4, 2000, pp. 116-17, 120.
------, "The New Intel: Craig Barrett Is Leading the Chip Giant into Riskier Terrain," Business Week, March 13, 2000, pp. 110+.
------, "Who Says Intel's Chips Are Down?," Business Week, December 7, 1998, p. 103.
Reinhardt, Andy, Ira Sager, and Peter Burrows, "Intel: Can Andy Grove Keep Profits Up in an Era of Cheap PCs?," Business Week, December 22, 1997, pp. 71-74, 76-77.
A Revolution in Progress: A History of Intel to Date, Santa Clara, Calif.: Intel Corporation, 1984.
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------, "Intel Unleashes Its Inner Attila," Fortune, October 15, 2001, pp. 168-70+.
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Yu, Albert, Creating the Digital Future: The Secrets of Consistent Innovation at Intel, New York: Free Press, 1998, 214 p.
— April Dougal Gasbarre; Updated by David E. Salamie

Britannica Concise Encyclopedia: Intel Corp. Top
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U.S. manufacturer of semiconductor computer circuits. Intel was founded in 1968 as NM Electronics by Robert Noyce and Gordon Moore, inventors of the integrated circuit, to manufacture large-scale integrated (LSI) circuits. In the early 1970s it introduced the most powerful semiconductor chips then known, which soon replaced the magnetic cores previously used in computer memories. IBM chose to use Intel's 8088 microprocessor (introduced 1978) in its first personal computer (the IBM PC), and Intel microprocessors became standard for all PC-type machines. Although other manufacturers eventually developed Intel-compatible microprocessors, Intel continued to power more than 75% of PCs at the beginning of the 21st century.
For more information on Intel Corp., visit Britannica.com.

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